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Sat, 31 July 2010 03:22 PM

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The following articles have been placed on our site by vistors to Plastics News International. Some of these stories will be selected for our print version.

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Intertronics get tough with electronic components

Those clever people at Intertronics are getting tough with electronic
components that need to be made more rugged – to be more resistant to
shock, vibration and rough handling. This “toughening-up” process
involves edge bonding or underfill of components with the recently
introduced DYMAX 9422-SC or 9-20790 room temperature, fast, light cure
adhesives.

In particular the 9422-SC is a component reinforcement and staking
material engineered to hold critical components, such as Ball Grid Arrays
(BGA) and Video Graphic Arrays (VGA), for secondary processes or for long-
term reliability. These light-curable adhesives dispense and cure in
seconds to provide the optimal balance of production efficiency and
technical performance. This will be of interest to anyone confronted with
the need to ensure that critical components on printed circuit boards
remain in place and with electrical integrity throughout the
manufacturing, assembly qualification and service environment for the
duration of a product lifecycle. Light curing adhesives dispense and cure
in seconds to provide the optimal balance of production efficiency and
technical performance with bead shape designed to wet both the board
surface and the component edge without seeping into shadowed areas. This
material is highly thixotropic for zero movement prior to cure - 9422-SC
is halogen and silicone free and RoHS compliant.

The use of BGA edge bonding adhesives or underfills can eliminate
leadless component interconnect cracking due to CTE mismatches. Typical
applications include mobile phones, PDAs, laptop computers, gaming
consoles, GPS computers and digital music players.

DYMAX 9422-SC features “See-Cure” technology (going from blue when
uncured to colourless when cured) and features fast dispense and cure,
easy re-work, simple visual inspection and covering in seconds with
improved bond strength for die and pry testing. Further information
regarding Intertronics’ products can be found at www.intertronics.co.uk.


- Submitted by Peter Swanson




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  • © The Editors Desk Pty Ltd 2009
    Postal: 2002 The Summit, 163 City Rd, Southbank, Victoria, Australia 3006
    Email: publisher@plasticsnews.net

    Plastics News International ISSN 1328-7451