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Sat, 31 July 2010 03:26 PM

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Fast cure, no mixing, superior performance encapsulant from Intertronics

Intertronics’ latest introduction to the world of electronic encapsulants
is the Multi-Cure® 9001-E series which addresses the age old problems of
time and mess/mixing with consummate success. This DYMAX Multi-Cure® 9001-
E Series of encapsulants cure in as little as 5 seconds to provide
superior moisture and abrasion resistance and thermal cycle performance
of electronic and microelectronic assemblies. The fast cure on exposure
to long wave UV and visible light minimizes processing and energy costs
associated with alternative technologies that require mixing or elevated
temperatures for curing. The 9001-E materials are all one part, so no
mixing is required and consistent viscosity is maintained – in addition
various viscosities are available from 400cP to 50,000cP to provide
optimal coverage over various geometries.

Multi-Cure 9001-E series materials have high ionic purity, are solvent
free, and isocyanate free. They have been engineered to have a low
modulus to minimize stress on delicate wire bonds. When exposed to
UV/visible light they will cure in seconds, while any shadowed areas will
cure upon heat exposure. To prevent damage of fine wires, these
encapsulants contain no sharp, abrasive mineral or glass fillers. They
may be dispensed from a variety of automatic bench-top syringe
applicators or other equipment and require only relatively low cost light
sources to instigate the curing process.

Multi-Cure 9001-E Series encapsulants display excellent adhesion to
polyimide, PET, flexible printed circuits, FR4 and ceramic boards, and
provide superior protection for glob top and COB (chip on board)
applications. They are ideal for encapsulating ICs on flex circuits, also
for multi-chip modules. Further information regarding Intertronics’
products can be found at www.intertronics.co.uk.


- Submitted by Peter Swanson




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  • © The Editors Desk Pty Ltd 2009
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    Email: publisher@plasticsnews.net

    Plastics News International ISSN 1328-7451